Electromagnetic connector for for an industrial control system

ABSTRACT

An electromagnetic connector is disclosed that is configured to form a first magnetic circuit portion comprising a first core member and a first coil disposed of the first core member. The electromagnetic connector is configured to mate with a second electromagnetic connector, where the second electromagnetic connector is configured to form a second magnetic circuit portion comprising a second core member and a second coil disposed of the second core member. The first core member and the second core member are configured to couple the first coil to the second coil with a magnetic circuit formed from the first magnetic circuit portion and the second magnetic circuit portion when the electromagnetic connector is mated with the second electromagnetic connector. The magnetic circuit is configured to induce a signal in the first coil when the second coil is energized.

BACKGROUND

Electrical connectors are mechanical assemblies used to complete anelectrical circuit or join two or more electrical circuits together.Plug and socket type electrical connectors generally include a male plugand a female receptacle, with multiple pin or prong contacts in the maleplug configured for insertion into openings in a mating socket of thefemale receptacle. Multi-pin connectors employ multiple metal pins.Thus, the connections between mating metal parts (e.g., pins andsockets) must be capable of furnishing good electrical connections tocomplete the electrical circuits. For example, multi-pin connectors areused as interconnects in Industrial Control Systems (ICS)/ProcessControl Systems (PCS) to connect Input/Output (I/O) devices to powerand/or communications signal transmission circuitry. Such circuitry maybe used by, for instance, a power backplane, where multiple electricalconnectors are connected in parallel to a common electrical powersupply. Other types of electrical connectors include: Eight Positions,Eight Conductors (8P8C) modular connectors used for Ethernet andCategory 5 (CAT5) cables; D-subminiature connectors used for RecommendedStandard 232 (RS-232) modem serial ports, computers, telecommunications,test/measurement instruments, monitors, joysticks, mice, and gameconsoles; Universal Serial Bus (USB) connectors, including Type A, TypeB, Mini-A, Mini-B, Micro-A, and Micro-B connectors used for interfacingdevices; electrical power connectors, such as Alternating Current (AC)power plugs and sockets (e.g., plugs having protruding prongs, blades,and/or pins that fit into matching slots and/or holes in sockets,receptacles, outlets, power points, and so forth), and Direct Current(DC) connectors, such as coaxial power connectors; as well as RadioFrequency (RF) connectors for transmitting RF signals; and the like.

SUMMARY

An electromagnetic connector is disclosed. In one or moreimplementations, the electromagnetic connector is configured to form afirst magnetic circuit portion that comprises a first core member and afirst coil disposed of the first core member. The electromagneticconnector is configured to mate with a second electromagnetic connector,where the second electromagnetic connector is configured to form asecond magnetic circuit portion that comprises a second core member anda second coil disposed of the second core member. The first core memberand the second core member are configured to couple the first coil tothe second coil with a magnetic circuit formed from the first magneticcircuit portion and the second magnetic circuit portion when theelectromagnetic connector is mated with the second electromagneticconnector. The magnetic circuit is configured to induce a signal in thefirst coil when the second coil is energized.

This Summary is provided to introduce a selection of concepts in asimplified form that are further described below in the DetailedDescription. This Summary is not intended to identify key features oressential features of the claimed subject matter, nor is it intended tobe used as an aid in determining the scope of the claimed subjectmatter.

DRAWINGS

The Detailed Description is described with reference to the accompanyingfigures. The use of the same reference numbers in different instances inthe description and in FIGS. 2 through 15 may indicate similar oridentical items.

FIG. 1 is a block diagram illustrating an industrial control systemusing a backplane for power transmission, where arrows are used toindicate power flow.

FIG. 2 is a partial cross-sectional isometric view illustratingelectromagnetic connectors in accordance with example implementations ofthe present disclosure.

FIG. 3A is a diagrammatic illustration of a connector assemblycomprising an E-shaped core member for coupling a module to a backplanein accordance with example implementations of the present disclosure.

FIG. 3B is a diagrammatic illustration of the connector assemblyillustrated in FIG. 3A, where electromagnetic connectors are mated tocouple the module to the backplane.

FIG. 4A is a diagrammatic illustration of a connector assemblycomprising an interference core for coupling a module to a backplane inaccordance with example implementations of the present disclosure.

FIG. 4B is a diagrammatic illustration of the connector assemblyillustrated in FIG. 4A, where electromagnetic connectors are mated tocouple the module to the backplane.

FIG. 4C is a diagrammatic illustration of a connector assemblycomprising an interference core and a protective cover for coupling amodule to a backplane in accordance with example implementations of thepresent disclosure.

FIG. 4D is a diagrammatic illustration of the connector assemblyillustrated in FIG. 4C, where electromagnetic connectors are mated tocouple the module to the backplane.

FIG. 5 is a block diagram illustrating a system for distributing powerand/or communications signals along a backplane using distributedtransformers implemented with electromagnetic connectors in accordancewith example implementations of the present disclosure, where arrows areused to indicate power flow.

FIG. 6 is a circuit diagram of the system illustrated in FIG. 5 .

FIG. 7 is a block diagram illustrating a communications control systemin accordance with example implementations of the present disclosure.

FIG. 8 is a circuit diagram illustrating a switch fabric for acommunications control system in accordance with example implementationsof the present disclosure.

FIG. 9 is an isometric view illustrating a communications control systemin accordance with example implementations of the present disclosure.

FIG. 10 is a side elevation view of the communications control systemillustrated in FIG. 9 .

FIG. 11 is an end view of the communications control system illustratedin FIG. 9 .

FIG. 12 is a partial cross-sectional end view of the communicationscontrol system illustrated in FIG. 9 .

FIG. 13 is a cross-sectional end view illustrating an input/outputmodule for the communications control system illustrated in FIG. 9 .

FIG. 14 is an isometric view illustrating a support frame with anattached circuit board for the communications control system illustratedin FIG. 9 .

FIG. 15 is a flow diagram illustrating a process of forming a firstelectromagnetic connector configured to form a first magnetic circuitportion comprising a first core member and a first coil disposed of thefirst core member, forming a second electromagnetic connector configuredto form a second magnetic circuit portion comprising a second coremember and a second coil portion disposed of the second core member, andcoupling the first coil to the second coil by mating the firstelectromagnetic connector with the second electromagnetic connector inaccordance with example implementations of the present disclosure.

DETAILED DESCRIPTION Overview

Multi-pin connectors are typically used in industrial controlsystems/process control systems to connect I/O devices to power and/orcommunications signal transmission circuitry included with a powerbackplane. The pin interconnects provide high precision signalresolution and are often constructed from high quality materials, suchas hardened steel with gold plating, and so forth. Care must be takenwhen connecting and disconnecting multi-pin connectors to avoid bendingor misaligning the various pins. Additionally, in both industrialsettings and in the field, pin interconnects are often exposed tocorrosive materials and contaminants, and may be subject to oxidationand coating, leading to intermittent failures. The nature and cause ofthe failures may be difficult and costly to determine. Thus, multi-pinconnectors are generally a high cost and high maintenance component ofindustrial control systems hardware.

Industrial control systems/process control systems may also requireelectrical isolation between I/O devices and associated powertransmission and control equipment. For example, I/O devices typicallyuse transformers and/or optical equipment for signal transmission toelectrically isolate the I/O devices, prevent ground loops, and soforth. Industrial systems, such as the example system 10 shown in FIG. 1, may provide a backplane 12 for power and/or communications signaltransmission, with pluggable I/O devices 14 connected to the backplane12. Each pluggable I/O device 14 may use multi-pin connectors 16 forboth power and communications transmissions, along with Pulse-WidthModulation (PWM)/Pulse-Duration Modulation (PDM) 18 and a powertransformer 20 to achieve isolation between the backplane 12 and the I/Odevices 14. For example, the backplane 12 may use a DC power source 22and connectors 24 that mate with connectors 16 to deliver DC signals tothe I/O devices 14. Each I/O device 14 may then use PWM 18 to convertthe DC signals to AC and transformer 20 to deliver thepower/communications signals to circuitry 26. The use of the highquality multi-pin connectors, PWM circuitry, and power transformersincreases the cost and complexity of the I/O devices.

Accordingly, electromagnetic connector assemblies are described thatemploy electromagnetic connectors which form portions of a magneticcircuit. The electromagnetic connectors comprise a core member and acoil disposed of the core member. In implementations, theelectromagnetic connectors are configured to mate with otherelectromagnetic connectors so that, when one electromagnetic connectoris mated with another electromagnetic connector, the core members of theconnectors couple the coil of the first connector to the coil of thesecond connector to complete the magnetic circuit. The magnetic circuitis configured to induce a signal in one coil when the other coil isenergized.

Electromagnetic connectors configured in accordance with the presentdisclosure need not necessarily require precision contact, pressure,and/or alignment to complete the magnetic circuit linking the tightlycoupled coils. In implementations, the electromagnetic connectors can beused in industrial control systems having a power backplane/busconfiguration. For example, the electromagnetic connectors can be usedwith one or more I/O modules in place of the PWM, separate powertransformer, and associated transistors that would otherwise be requiredfor each I/O module to maintain isolation between the I/O modules andthe power backplane. The electromagnetic connectors can also be used inplace of multi-pin connectors for communications and/or power signaltransmission. Eliminating multiple PWM’s, power transformers,transistors, and multi-pin connectors can provide a significant cost andspace savings for this type of configuration, along with increasedgalvanic isolation between sensor and control components. Further,contactless interconnection for signal transmission may provide moreenvironmentally robust structures, reducing or eliminating fieldfailures due to corrosion, pin misalignment, and so forth.

In one or more implementations, the electromagnetic connector assembliesmay be employed in a system that includes a backplane for distributingan AC signal. The system may include a number of electromagneticconnectors coupled with the backplane. As described herein, theelectromagnetic connectors comprise a core member and a coil disposed ofthe core member (e.g., as previously described). Each one of theelectromagnetic connectors is configured to mate with anotherelectromagnetic connector, which may be included within a module. Whenthe electromagnetic connectors are mated, the coils are coupled via amagnetic circuit. The magnetic circuit is configured to induce a signalin a coil of the module when a coil of the backplane is energized. Thebackplane may be used to power and/or furnish communications withcircuitry of the module.

The system can be configured for an industrial control system/processcontrol system having a multidrop power backplane/bus configuration thattransmits high frequency AC power using DC-to-AC (DC/AC) conversioncircuitry and distributed transformers, with electromagnetic connectorsconfigured as previously described. A system configured in accordancewith the present disclosure can eliminate the use of a separate PWM foreach I/O device, replacing multiple PWMs with, for example, a single PWMlocated on the backplane. Thus, the connector and power transformerconfiguration described with reference to FIG. 1 can be replaced withmagnetic circuits (e.g., tightly coupled transformers). Each magneticcircuit may be configured as two portions (e.g., halves) of atransformer, where one portion (e.g., half) of the transformer islocated in each module, and the other portion (e.g., half) is located inthe backplane. The portion of the transformer in the backplane maycomprise, for example, the primary coil and a portion of the core. Theportion of the transformer in each module may comprise the secondarycoil and a mating core. Electrical power in the primary coil isextracted by the secondary coil, and can then be rectified and used topower and/or communicate with circuitry in each module.

For example, a system configured in accordance with the presentdisclosure may be implemented as a communications control system thatincludes a switch fabric having a serial communications interface (e.g.,a serial or Multidrop Bus (MDB) with a master and multiple slaves) and aparallel communications interface (e.g., a parallel or point-to-pointbus implemented using a cross switch, or the like). The serialcommunications interface and the parallel communications interface maybe used for connecting multiple Input/Output (I/O) modules tocommunications/control modules, and to one another.

The serial communications interface and the parallel communicationsinterface may be formed on a single printed circuit board. The serialcommunications interface may be configured for connecting the pluralityof input/output modules to a redundant control module in parallel, andthe parallel communications interface may be configured for separatelyconnecting the plurality of input/output modules to the redundantcontrol module. Information transmitted via the serial communicationsinterface and/or the parallel communications interface may bepacketized. The control module may comprise a network interface fortransmitting information collected from the plurality of input/outputmodules via a network, and so forth. Additionally, the communicationscontrol system may include a power module for supplying electrical powerto at least one of the plurality of input/output modules.

Example Implementations

FIGS. 2 through 4D illustrate example electromagnetic connectors 100 ofconnector assemblies 110 in accordance with example implementations ofthe present disclosure. The electromagnetic connectors 100 may be usedin any application where it is desirable to couple electrical circuitstogether for transmitting electrical signals and/or electrical powerfrom one circuit to another, while maintaining isolation between thecircuits. The electromagnetic connectors 100 can be used in applicationsincluding, but not necessarily limited to: industrial controlsystems/process control systems (e.g., to connect I/O devices with powerand/or communications signal transmission circuitry), telecommunications(e.g., for audio, broadband, video, and/or voice transmission),information/data communications (e.g., for connecting computernetworking equipment, such as Ethernet equipment, modems, and so forth),computer hardware interconnection (e.g., for connecting peripherals,such as joysticks, keyboards, mice, monitors, and so on), game consoles,test/measurement instruments, electrical power connectors (e.g., forpower transmission from AC mains), and the like.

Each one of the electromagnetic connectors 100 is configured to form amagnetic circuit portion 102, which includes a core member 104 and acoil 106 disposed of (e.g., around or within) the core member 104. Forthe purposes of the present disclosure, it should be noted that “coremember” is used to refer to an incomplete part of a magnetic core, whichis completed by another core member when the electromagnetic connectors100 are coupled together. Each electromagnetic connector 100 isconfigured to mate with another electromagnetic connector 100 of aconnector assembly 110 for transmitting power and/or communicationssignals between components that are connected via the electromagneticconnectors 100. For example, a first core member 104 of anelectromagnetic connector 100 can be configured to contact a second coremember 104 of another electromagnetic connector 100 when the firstelectromagnetic connector 100 is mated with the second electromagneticconnector 100 (e.g., as shown in FIG. 3B). In this manner, a coil 106 ofthe first electromagnetic connector 100 can be tightly coupled toanother coil 106 of the second electromagnetic connector 100 with amagnetic circuit 108 formed from the magnetic circuit portion 102 of thefirst electromagnetic connector 100 and the magnetic circuit portion 102of the second electromagnetic connector 100. The magnetic circuit 108 isconfigured to induce a signal in one of the coils 106 when the othercoil 106 is energized, allowing power and/or communications signals tobe transmitted between components that are connected via theelectromagnetic connectors 100. In implementations, the coils 106 can betightly coupled (e.g., using an iron core to provide a couplingcoefficient of about one (1)), critically coupled (e.g., where energytransfer in the passband is optimal), or overcoupled (e.g., where asecondary coil is close enough to a primary coil to collapse the primarycoil’s field).

Referring to FIGS. 4A through 4D, the first core member 104 may notnecessarily be configured to contact the second core member 104 when thefirst electromagnetic connector 100 is mated with the secondelectromagnetic connector 100 (e.g., as shown in FIGS. 4B and 4D). Thus,an electromagnetic connector assembly 110 can be configured to transmitpower and/or communications signals between components that areconnected via electromagnetic connectors 100 using, for example, aninterference fit configuration, e.g., as shown in FIGS. 4A through 4D,where one coil 106 is disposed around a first core portion 104, whileanother coil 106 is disposed within a second core portion 104. Theinterference fit may be established using connectors having geometriesincluding, but not necessarily limited to: conical, concentric,eccentric, geometric, sloped for friction fit, and so forth.

In implementations, one or both of the core members 104 and/or coils 106can be at least partially (e.g., fully or partially) mechanicallyencased within a protective layer. The protective layer may befabricated of a non-conductive/insulating material, such as a coating ofthin film plastic material. The protective layer (e.g.,non-conductive/insulating material) can be applied using techniquesincluding, but not necessarily limited to: coating, painting,deposition, and so forth. For instance, as shown in FIGS. 4C and 4D, thecore member 104 and coil 106 of a first electromagnetic connector 100included within module 122 is partially enclosed by a cover 126, while asecond electromagnetic connector 100 included within backplane 120includes a shaft 128 configured to mate with the cover 126. In thismanner, the cover 126 and the shaft 128 may be configured to ensureproper alignment of the first electromagnetic connector 100 with thesecond electromagnetic connector 100, while protecting the core members104 and/or the coil 106 of the first electromagnetic connector 100 fromcorrosion, mechanical damage (e.g., fracture), and so forth. Encasementmay be especially useful when a core member 104 is constructed from abrittle material. For instance, the core member 104 can be tightlyencased in a protective layer formed of a plastic material. In thismanner, when damage to the core member (e.g., cracks or breaks in thecore member) occurs, the pieces of material can be maintained insubstantial contact with one another within the casing, thus damage tothe core material may not significantly decrease performance.

FIGS. 3A through 6 illustrate an example system 114 in accordance withexample implementations of the present disclosure. The system 114includes DC/AC conversion circuitry, such as DC/AC converter 116, or thelike, for converting a DC signal to an AC signal. For instance, the DCsignal may be supplied from a DC power source 118 and converted to an ACsignal using the DC/AC converter 116. In implementations, the DC/ACconverter 116 can be implemented using a PWM/PDM. However, the PWM/PDMis provided by way of example only and is not meant to be restrictive ofthe present disclosure. Thus, DC/AC converter 116 may be implementedusing other DC/AC conversion circuitry, including, but not necessarilylimited to: a voltage to frequency converter and/or a cascade topology(e.g., where two or more PWM’s are connected in cascade). The system 114also includes one or more backplanes 120, each coupled with a DC/ACconverter 116 for distributing the AC signal from the DC/AC converter116. Each backplane 120 has a number of electromagnetic connectors 100,where each one of the electromagnetic connectors 100 includes a coremember 104 and a coil 106 disposed of the core member 104 (e.g., aspreviously described). Each one of the electromagnetic connectors 100included with a backplane 120 is configured to mate with anotherelectromagnetic connector 100 that can be included with, for example,modules 122, and so forth.

When the electromagnetic connectors 100 are mated, a core member 104 ofthe backplane 120 and a core member 104 of a module 122 are configuredto couple the coils 106 via magnetic circuit 108. The magnetic circuit108 is configured to induce a signal in coil 106 of module 122 when coil106 of backplane 120 is energized (e.g., with the AC signal from DC/ACconverter 116). The signal induced in coil 106 of module 122 may be usedto power and/or furnish communications with circuitry 124 of module 122.It should be noted that while backplane 120 is described as inducing asignal in module 122, this implementation is provided by way of exampleonly and is not meant to be restrictive of the present disclosure. Thus,the magnetic circuit 108 can also be used to induce a signal in a coil106 of backplane 120 when a coil 106 of module 122 is energized to powerand/or furnish communications with backplane 120. Further, the coilsincluded with mating electromagnetic connectors may be energized in analternating sequence (e.g., one after another) to provide bidirectionalcommunication, and so forth.

FIGS. 7 through 14 illustrate an example communications control system200 in accordance with the present disclosure. In implementations, thecommunications control system 200 may be configured for use with processcontrol systems technology, and so forth. For example, thecommunications control system 200 may be used with a distributed controlsystem comprised of controller elements and subsystems, where thesubsystems are controlled by one or more controllers distributedthroughout the system. The communications control system 200 includes aswitch fabric 202 comprising a serial communications interface 204 and aparallel communications interface 206 for furnishing communications witha number of I/O modules 208. As shown in FIGS. 7 and 14 , the I/Omodules 208 can be connected to the communications control system 200using one or more electromagnetic connectors 100 (e.g., as shown anddescribed with reference to FIGS. 2 through 6 ). For instance, each I/Omodule 208 can include one or more connectors 100/connector assemblies110, with core members extending through coils.

As shown in FIG. 2 , the coils can be implemented as planar windings ona circuit board. When included in a module 208, the circuit board can be“floated” against a partial spring load, allowing for some movement ofthe circuit board perpendicular to the plane of a core member, e.g., tocompensate for tolerances across the circuit board. For example, aself-holding spring loading mechanism can be provided in the module toprovide a constant downward pressure to facilitate mating of theelectromagnetic connection, compensating for stacked tolerances of themodule, PCB, and baseplate/support frame and ensuring a constant matingof both halves of an electromagnetic connector assembly. In a particularimplementation, a “tongue and groove” configuration can be used thatprovides inherent fastening and support in three planes. For example, aprinted circuit board included within an I/O module 208 can beconfigured to slide along and between two track segments in a directionperpendicular to the plane of a core member. Further, a core member canbe mechanically isolated from (e.g., not touching) the circuit board. Itshould be noted that the implementation with planar primary andsecondary windings described with reference to FIG. 2 is provided by wayof example only and is not necessarily meant to be restrictive of thepresent disclosure. Thus, other implementations can use other coilconfigurations, such as wire wound coils, and so forth. For example, theprimary coil may comprise a planar winding, and the secondary coil maycomprise a wire wound coil. Further, the primary coil may comprise awire wound coil, and the secondary coil may comprise a planar winding.In other implementations, primary and secondary coils may both comprisewire wound coils.

The serial communications interface 204 may be implemented using a groupof connectors connected in parallel with one another. In one or moreimplementations, the connectors may be configured as electromagneticconnectors 100/connector assemblies 110 (e.g., as previously described).For example, the serial communications interface 204 may be implementedusing a multidrop bus 210, or the like. In implementations, themultidrop bus 210 may be used for configuration and diagnostic functionsof the I/O modules 208. The parallel communications interface 206 allowsmultiple signals to be transmitted simultaneously over multiplededicated high speed parallel communication channels. For instance, theparallel communications interface 206 may be implemented using a crossswitch 212, or the like.

In a particular implementation, as described in FIG. 8 , the parallelcommunications interface 206 can be implemented using a four (4) wirefull duplex cross switch 212 with a dedicated connection to each I/Omodule 208. In implementations, each connection may be furnished usingone or more electromagnetic connectors 100/connector assemblies 110(e.g., as previously described). The cross switch 212 can be implementedas a programmable cross switch connecting point-to-point busses andallowing traffic between the I/O modules 208. The cross switch 212 maybe configured by a master device, such as a communications/controlmodule 214. For example, a communications/control module 214 mayconfigure one or more sets of registers included in the cross switch 212to control traffic between the I/O modules 208. In implementations, acommunications/control module 214 may comprise a rule set dictating howthe I/O modules 208 are interconnected. For example, acommunications/control module 214 may comprise a set of registers, whereeach register defines the operation of a particular switch (e.g., withrespect to how packets are forwarded, and so forth). Thus, the crossswitch 212 may not necessarily auto-configure, instead implementing aconfiguration provided by a communications/control module 214. However,this configuration is provided by way of example only and is not meantto be restrictive of the present disclosure. Thus, in otherimplementations, the cross switch 212 may auto-configure.

The parallel communications interface 206 may be used for datacollection from the I/O modules 208. Further, because each I/O module208 has its own private bus to the master (e.g., communications/controlmodules 214), each I/O module 208 can communicate with the master at thesame time. Thus, the total response time for the communications controlsystem 200 may be limited to that of the slowest I/O module 208, insteadof the sum of all slave devices.

In implementations, the switch fabric 202, the serial communicationsinterface 204, and the parallel communications interface 206 may beimplemented in a single, monolithic circuit board 216, e.g., withmultiple E-shaped core members of electromagnetic connectors 100extending through the circuit board 216, as shown in FIG. 14 . Inimplementations, the core members may be mechanically isolated from thecircuit board 216 (e.g., not touching the circuit board 216). However,this configuration is provided by way of example only and is not meantto be restrictive of the present disclosure. Thus, the serialcommunications interface 204 and the parallel communications interface206 may be implemented using different arrangements of multiplecomponents, such as multiple discrete semiconductor devices forimplementing the serial communications interface 204 and the parallelcommunications interface 206 separately, and so forth.

The switch fabric 202 may be configured for connecting one or more I/Omodules 208 and transmitting data to and from the I/O modules 208. TheI/O modules 208 may comprise input modules, output modules, and/or inputand output modules. For instance, input modules can be used to receiveinformation from input instruments in the process or the field, whileoutput modules can be used to transmit instructions to outputinstruments in the field. For example, an I/O module 208 can beconnected to a process sensor, such as a sensor 218 for measuringpressure in piping for a gas plant, a refinery, and so forth. Inimplementations, the I/O modules 208 may be used to collect data andcontrol systems in applications including, but not necessarily limitedto: industrial processes, such as manufacturing, production, powergeneration, fabrication, and refining; infrastructure processes, such aswater treatment and distribution, wastewater collection and treatment,oil and gas pipelines, electrical power transmission and distribution,wind farms, and large communication systems; facility processes forbuildings, airports, ships, and space stations (e.g., to monitor andcontrol Heating, Ventilation, and Air Conditioning (HVAC) equipment andenergy consumption); large campus industrial process plants, such as oiland gas, refining, chemical, pharmaceutical, food and beverage, waterand wastewater, pulp and paper, utility power, mining, metals; and/orcritical infrastructures.

In implementations, the I/O module 208 may be configured to convertanalog data received from the sensor 218 to digital data (e.g., usingAnalog-to-Digital Converter (ADC) circuitry, and so forth). An I/Omodule 208 may also be connected to a motor 220 and configured tocontrol one or more operating characteristics of the motor 220, such asmotor speed, motor torque, and so forth. Further, the I/O module 208 maybe configured to convert digital data to analog data for transmission tothe motor 220 (e.g., using Digital-to-Analog (DAC) circuitry, and soforth). In implementations, one or more of the I/O modules 208 maycomprise a communications module configured for communicating via acommunications sub-bus, such as an Ethernet bus, an H1 field bus, aProcess Field Bus (PROFIBUS), a Highway Addressable Remote Transducer(HART) bus, a Modbus, and so forth. Further, two or more of the I/Omodules 208 can be used to provide fault tolerant and redundantconnections for a communications sub-bus.

Each I/O module 208 may be provided with a unique identifier (ID) fordistinguishing one I/O module 208 from another I/O module 208. Inimplementations, an I/O module 208 may be identified by its ID when itis connected to the communications control system 200. Multiple I/Omodules 208 can be used with the communications control system 200 toprovide redundancy. For example, two or more I/O modules 208 can beconnected to the sensor 218 and/or the motor 220, as described in FIG. 7. Each I/O module 208 can include one or more ports 222 furnishing aphysical connection to hardware and circuitry included with the I/Omodule 208, such as a Printed Circuit Board (PCB) 224, and so forth.

One or more of the I/O modules 208 may include an interface forconnecting to other networks, including but not necessarily limited to:a wide-area cellular telephone network, such as a 3G cellular network, a4G cellular network, or a Global System for Mobile communications (GSM)network; a wireless computer communications network, such as a Wi-Finetwork (e.g., a Wireless LAN (WLAN) operated using IEEE 802.11 networkstandards); a Personal Area Network (PAN) (e.g., a Wireless PAN (WPAN)operated using IEEE 802.15 network standards); a Wide Area Network(WAN); an intranet; an extranet; an internet; the Internet; and so on.Further, one or more of the I/O modules 208 may include a connection forconnecting an I/O module 208 to a computer bus, and so forth.

The switch fabric 202 may be coupled with one or morecommunications/control modules 214 for monitoring and controlling theI/O modules 208, and for connecting the I/O modules 208 together. Thecommunications/control module(s) 214 may be used to configure the crossswitch 212. For example, a communications/control module 214 may updatea routing table when an I/O module 208 is connected to thecommunications control system 200 based upon a unique ID for the I/Omodule 208. Further, when multiple redundant I/O modules 208 are used,each communications/control module 214 can implement mirroring ofinformational databases regarding the I/O modules 208 and update them asdata is received from and/or transmitted to the I/O modules 208. In someimplementations, two or more communications/control modules 214 may beused to provide redundancy.

Data transmitted using the switch fabric 202 may be packetized, i.e.,discrete portions of the data may be converted into data packetscomprising the data portions along with network control information, andso forth. The communications control system 200 may use one or moreprotocols for data transmission, including a bit-oriented synchronousdata link layer protocol such as High-Level Data Link Control (HDLC). Ina specific instance, the communications control system 200 may implementHDLC according to an International Organization for Standardization(ISO) 13239 standard, or the like. Further, two or morecommunications/control modules 214 can be used to implement redundantHDLC. However, it should be noted that HDLC is provided by way ofexample only and is not meant to be restrictive of the presentdisclosure. Thus, the communications control system 200 may use othervarious communications protocols in accordance with the presentdisclosure.

One or more of the communications/control modules 214 may be configuredfor exchanging information with components used for monitoring and/orcontrolling the instrumentation connected to the switch fabric 202 viathe I/O modules 208, such as one or more control loop feedbackmechanisms/controllers 226. In implementations, a controller 226 can beconfigured as a microcontroller/Programmable Logic Controller (PLC), aProportional-Integral-Derivative (PID) controller, and so forth. One ormore of the communications/control modules 214 may include a networkinterface 228 for connecting the communications control system 200 to acontroller 226 via a network 230. In implementations, the networkinterface 228 may be configured as a Gigabit Ethernet interface forconnecting the switch fabric 202 to a Local Area Network (LAN). Further,two or more communications/control modules 214 can be used to implementredundant Gigabit Ethernet. However, it should be noted that GigabitEthernet is provided by way of example only and is not meant to berestrictive of the present disclosure. Thus, the network interface 228may be configured for connecting the communications control system 200to other various networks, including but not necessarily limited to: awide-area cellular telephone network, such as a 3G cellular network, a4G cellular network, or a Global System for Mobile communications (GSM)network; a wireless computer communications network, such as a Wi-Finetwork (e.g., a Wireless LAN (WLAN) operated using IEEE 802.11 networkstandards); a Personal Area Network (PAN) (e.g., a Wireless PAN (WPAN)operated using IEEE 802.15 network standards); a Wide Area Network(WAN); an intranet; an extranet; an internet; the Internet; and so on.Additionally, the network interface 228 may be implemented usingcomputer bus. For example, the network interface 228 can include aPeripheral Component Interconnect (PCI) card interface, such as a MiniPCI interface, and so forth. Further, the network 230 may be configuredto include a single network or multiple networks across different accesspoints.

The communications control system 200 may include one or more powermodules 232 for supplying electrical power to field devices via the I/Omodules 208. One or more of the power modules 232 may include anAC-to-DC (AC/DC) converter for converting Alternating Current (AC)(e.g., as supplied by AC mains, and so forth) to Direct Current (DC) fortransmission to a field device, such as the motor 220 (e.g., in animplementation where the motor 220 comprises a DC motor). Two or morepower modules 232 can be used to provide redundancy. For example, asshown in FIG. 7 , two power modules 232 can be connected to each of theI/O modules 208 using a separate (redundant) power backplane 234 foreach power module 232. One or more of the power backplanes 234 can beimplemented in the manner of the backplane 120 described with referenceto FIGS. 3A through 6 . In implementations, power backplane 234 may beconnected to one or more of the I/O modules 208 using electromagneticconnectors 100/connector assemblies 110 (e.g., as previously described).In implementations, power backplane 234 may be included with circuitboard 216, along with serial communications interface 204 and parallelcommunications interface 206. Power backplane 234 may include a PWN, andmay be configured in the manner of backplane 120 as shown in FIGS. 3Athrough 6 .

The communications control system 200 may be implemented using a supportframe 236. The support frame 236 may be used to support and/orinterconnect the communications/control module(s) 214, the powermodule(s) 232, the switch fabric 202, the power backplane(s) 234, and/orthe I/O modules 208. The circuit board 216 may be mounted to the supportframe 236 using a fastener such as, for example, double sided tape,adhesive, or mechanical fasteners (e.g., screws, bolts, etc.).Additionally, the core members of the electromagnetic connectors 100 maybe mounted to the support frame 236 using a fastener such as, forexample, double sided tape, adhesive, or mechanical fasteners (e.g.,screws, bolts, etc.). In some implementations, a template may be used toposition the core members in the channel of the support frame 236. Inimplementations, the top surface of a core member may be substantiallyflush with a top surface of the circuit board 216. In otherimplementations, the top surface of a core member may be recessed somedistance below a top surface of the circuit board 216 (e.g., by aboutone millimeter (1 mm)) and/or may extend above a top surface of thecircuit board 216.

The support frame 236 may include slots 238 to provide registration forthe I/O modules 208, such as for aligning connectors 100 of the I/Omodules 208 with connectors 100 included with the circuit board 216and/or connectors 100 of a power backplane 234. For example, an I/Omodule 208 may include connectors 240 having tabs/posts 242 forinserting into slots 238 and providing alignment of the I/O module 208with respect to the circuit board 216. In implementations, one or moreof the connectors 240 may be constructed from a thermally conductivematerial (e.g., metal) connected to a thermal plane of PCB 224 toconduct heat generated by components of the PCB 224 away from the PCB224 and to the support frame 236, which itself may be constructed of athermally conductive material (e.g., metal). Further, the communicationscontrol system 200 may associate a unique physical ID with each physicalslot 238 to uniquely identify each I/O module 208 coupled with aparticular slot 238. For example, the ID of a particular slot 238 can beassociated with an I/O module 208 coupled with the slot 238 and/or asecond ID uniquely associated with the I/O module 208. Further, the IDof a particular I/O module 208 can be used as the ID for a slot 238 whenthe I/O module 208 is coupled with the slot 238. The support frame 236can be constructed for cabinet mounting, rack mounting, wall mounting,and so forth.

It should be noted that while the communications control system 200 isdescribed in the accompanying figures as including one switch fabric202, more than one switch fabric 202 may be provided with communicationscontrol system 200. For example, two or more switch fabrics 202 may beused with the communications control system 200 (e.g., to providephysical separation between redundant switch fabrics 202, and so forth).Each one of the switch fabrics 202 may be provided with its own supportframe 236. Further, while both the serial communications interface 204and the parallel communications interface 206 are described as includedin a single switch fabric 202, it will be appreciated that physicallyseparate switch fabrics may be provided, where one switch fabricincludes the serial communications interface 204, and another switchfabric includes the parallel communications interface 206.

Example Process

Referring now to FIG. 15 , example techniques for formingelectromagnetic connectors and mating the electromagnetic connectors aredescribed.

FIG. 15 depicts a process 1500, in an example implementation, forforming one or more electromagnetic connectors, such as theelectromagnetic connectors 100/connector assemblies 110 illustrated inFIGS. 2 through 14 and described above, and mating the electromagneticconnectors. In the process 1500 illustrated, a first electromagneticconnector is provided, where the first electromagnetic connector isconfigured to form a first magnetic circuit portion (Block 1510). Thefirst magnetic circuit portion may, for instance, be constructed byproviding a first core member (Block 1512) and providing a first coildisposed of the first core member (Block 1514). For example, withreference to FIGS. 2 through 14 , a coil 106 is formed around or withina core member 104 to form a magnetic circuit portion 102 of anelectromagnetic connector 100. In implementations, the coil 106 may becomprised of planar windings, which may be printed on and/or embedded ina circuit board 112, as illustrated in FIG. 2 . However, planar windingsare provided by way of example only and are not meant to be restrictiveof the present disclosure. Thus, a coil 106 may comprise other windings,such as insulated copper windings wrapped around or within a core member104, and so forth.

One or more core members 104 of the electromagnetic connectors 100 maybe formed from an iron slurry material. However, this material isprovided by way of example only and is not meant to be restrictive ofthe present disclosure. Thus, a core member 104 may comprise anymaterial having a magnetic permeability suitable for confining andguiding magnetic fields generated by a coil 106, including, but notnecessarily limited to: soft magnetic materials (ie., magnetic materialswith low hysteresis, such as silicon steel), ferromagnetic metals (e.g.,iron), ferrimagnetic compounds (e.g., ferrites), and so forth.

While the core members 104 are shown as E-shaped in the accompanyingfigures, this particular shape is provided by way of example only and isnot meant to be restrictive of the present disclosure. Thus, a coremember 104 and/or the combined form of two mating core members 104 maycomprise other shapes and/or core geometries, including, but notnecessarily limited to: a straight cylindrical rod-shaped core, an “I”core, a “C”/“U” core, an “EFD” core, an “EP” core, an “ER” core, a potcore, a toroidal core, a ring/bead core, and so forth. For example, theshape of a core member 104 may be selected based upon acoupling/operating frequency. Further, a core member 104 can beimplemented as a planar core (e.g., with a planar winding). Inimplementations, the core member 104 may be formed in or on a circuitboard, e.g., along with a coil 106 formed as a planar winding, such thatthe core member 104 is electrically insulated from the coil 106 by oneor more portions of the circuit board.

In implementations where one core member 104 is configured to contactanother core member 104, the contact surfaces may be substantially flat(e.g., as illustrated in FIG. 2 ), but this configuration is provided byway of example only and is not meant to limit the present disclosure.Thus, other implementations may be provided, including implementationsdesigned to increase the surface area of contact between core membersand/or to provide self-alignment of the core members (e.g., byconfiguring a portion of one core member for insertion into another coremember). For example, one core member may comprise a tapered pinconfigured for insertion into a tapered hole of another core member,where the outside periphery and/or an end of the tapered pin isconfigured to contact a portion of the interior wall and/or a bottomsurface of the tapered hole.

One or more gaps may be provided between various points of a particularpair of mating core members 104. For example, as illustrated in FIGS. 3Aand 3B, when an E-shaped core member 104 is used, an air gap A_(G) maybe provided by shortening/truncating a middle leg of the E-shape. Forexample, one portion of the middle leg of the “E” may be fixedlyconnected to a first core member 104, while another portion of themiddle leg of the “E” may be supported proximal to, but not necessarilyin electrical contact with, a second core member 104 (e.g., as shown inFIGS. 3A and 3B). In this type of implementation, the portion of themiddle leg of the “E” for the second core member 104 may be supportedproximal to the second core member 104 using, for example, an insulatingmaterial. Further, an air gap may be provided by mating an E-shaped coremember 104 with a C-shaped core member, a U-shaped core member, anI-shaped core member, and so forth. For example, the middle leg of oneE-shaped core member can be configured to extend through both a firstcircuit board with a first coil comprising a planar winding, and asecond circuit board with second coil comprising a planar winding, wherethe outer legs of the E-shaped core member are configured to contact thelegs of another U-shaped core member. In this type of configuration, thecoil disposed of the U-shaped core member can be positioned between thelegs of the “U.”

In one or more implementations, a second electromagnetic connector maybe formed, where the second electromagnetic connector is configured toform a second magnetic circuit portion (Block 1512). The second magneticcircuit portion may be constructed by providing a second core member(Block 1522) and providing a second coil portion disposed of the secondcore member (Block 1524). For instance, with continuing reference toFIGS. 2 through 14 , a coil 106 is formed around or within a core member104 to form a magnetic circuit portion 102 of an electromagneticconnector 100, as previously described. Then, the first electromagneticconnector may be mated with the second electromagnetic connector (Block1530) to couple the first coil to the second coil with a magneticcircuit formed from the first magnetic ciruict portion and the secondmagnetic circuit portion (Block 1532). For example, with reference toFIG. 2 , a core member 104 of a first electromagnetic connector 100 of aconnector assembly 110 may be placed in contact with another core member104 of a second electromagnetic connector 100 of the connector assembly110 to tightly couple a coil 106 included with the first electromagneticconnector 100 with another coil 106 included with the secondelectromagnetic connector 100. Then, power and/or communications signalsmay be transmitted by energizing one of the coils 106 to induce a signalin the other coil 106.

Conclusion

Although the subject matter has been described in language specific tostructural features and/or process operations, it is to be understoodthat the subject matter defined in the appended claims is notnecessarily limited to the specific features or acts described above.Rather, the specific features and acts described above are disclosed asexample forms of implementing the claims.

What is claimed is:
 1. A backplane comprising: a substrate defining aplurality of apertures therethrough; a plurality of electromagneticconnectors at the apertures of the substrate, each one of the pluralityof electromagnetic connectors configured to form a first magneticcircuit portion, each electromagnetic connector configured to mate witha second electromagnetic connector of a module to couple the module withthe backplane, the second electromagnetic connector configured to form asecond magnetic circuit portion, the first magnetic circuit portion andthe second magnetic circuit portion configured to form a magneticcircuit when the electromagnetic connector is mated with the secondelectromagnetic connector and maintain isolation between the module andthe backplane.
 2. The backplane as recited in claim 1, wherein themagnetic circuit is configured for at least one of a communicationssignal or a power signal.
 3. The backplane as recited in claim 1,further comprising a cover for at least partially enclosing at least oneof the plurality of electromagnetic connectors.
 4. The backplane asrecited in claim 1, wherein at least one of the plurality ofelectromagnetic connectors comprises a planar winding disposed on thesubstrate.
 5. The backplane as recited in claim 1, wherein at least oneof the plurality of electromagnetic connectors comprises an E-shapedcore member.
 6. The backplane as recited in claim 1, wherein themagnetic circuit comprises an air gap.
 7. A system comprising: asubstrate comprising a plurality of electromagnetic connectors, each oneof the plurality of electromagnetic connectors comprising a firstelectromagnetic connector comprising a first core member and a firstcoil disposed about the first core member, the substrate defining anaperture therethrough, the first core member extending through theaperture defined by the substrate; and a module comprising a secondelectromagnetic connector comprising a second core member and a secondcoil disposed about the second core member, the second coil comprising awound coil, each respective first core member of the plurality ofelectromagnetic connectors and the second core member configured tocouple the first coil to the second coil to form a magnetic circuit whenthe first electromagnetic connector is mated with the secondelectromagnetic connector, the magnetic circuit configured to induce asignal in the second coil when the first coil is energized whilemaintaining isolation between the module and the substrate.
 8. Thesystem as recited in claim 7, wherein the signal induced in the secondcoil comprises at least one of a communications signal or a powersignal.
 9. The system as recited in claim 7, wherein the first coremember is configured to provide alignment with the second core memberwhen the first electromagnetic connector is mated with the secondelectromagnetic connector.
 10. The system as recited in claim 7, whereinthe first coil comprises a planar winding.
 11. The system as recited inclaim 7, wherein the first core member comprises an E-shaped coremember.
 12. The system as recited in claim 7, wherein the magneticcircuit formed from the first core member and the second core membercomprises an air gap.
 13. A system comprising: a backplane fordistributing an electrical signal, the backplane configured to providebidirectional communications; and a plurality of electromagneticconnectors coupled with the backplane, electromagnetic connectorconfigured to mate with a second electromagnetic connector of a moduleto couple the module with the backplane to form a magnetic circuit andprovide bidirectional communications between the backplane and themodule while maintaining isolation between the module and the backplane.14. The system as recited in claim 13, further comprising Direct Current(DC)-to-Alternating Current(AC) (DC/AC) conversion circuitry coupledwith the backplane for converting a DC signal to an AC signaldistributed via the backplane.
 15. The system as recited in claim 14,wherein the DC/AC conversion circuitry comprises Pulse-Width Modulation(PWM) circuitry.
 16. The system as recited in claim 13, furthercomprising: a plurality of modules configured to at least one oftransmit or receive data; a serial communications interface configuredfor connecting the plurality of modules in parallel; and a parallelcommunications interface configured to individually connect theplurality of modules.
 17. The system as recited in claim 16, wherein atleast one of the plurality of modules comprises the secondelectromagnetic connector, and at least one of the serial communicationsinterface or the parallel communications interface is connected to theat least one of the plurality of modules by mating the secondelectromagnetic connector with the electromagnetic connector.
 18. Thesystem as recited in claim 16, wherein the serial communicationsinterface comprises a multidrop bus.
 19. The system as recited in claim16, wherein the parallel communications interface comprises a crossswitch.
 20. The system as recited in claim 16, wherein the serialcommunications interface and the parallel communications interface areformed on a single substrate with the backplane.